In today's era of rapid technological advancement, the semiconductor industry, as the core of modern technology, makes every step of its production process crucial.
Silicon wafers, as a key material in semiconductor manufacturing, directly impact product quality and performance due to their surface cleanliness.
Traditional silicon wafer cleaning methods, such as chemical cleaning and mechanical brushing, while capable of removing impurities from the wafer surface to some extent, have numerous drawbacks.
Chemical cleaning requires large quantities of chemical reagents, resulting in high costs and environmental pollution.
Mechanical brushing easily scratches the silicon wafer surface, affecting subsequent processing and use. The emergence of
Laser Cleaning Machine technology has fundamentally changed this situation.
Laser
Cleaning Machine offer a non-contact cleaning method. They utilize high-energy-density laser beams to irradiate the silicon wafer surface, instantly stripping away dirt, oxide layers, and
Other impurities, achieving a cleaning effect.
This cleaning method is not only fast and efficient but also causes no physical damage to the silicon wafer surface and leaves no chemical residue, making it a truly green cleaning technology.
